COM Express Mini Heatspreader / Heatsink
Heatspreader/Heatsink for COM Express Mini Embedded Computer Modules
Intel® Bay Trail Atom™ E3800 series and Celeron® families
The specifications for COM Express™ Embedded Computer Modules include a heatspreader. It’s a mechanical definition of the thermal interface. All the heat generated by components such as chipsets and processors are transferred to the system’s cooling via the heatspreader.
SPECIFICATION
Material Aluminum
Dimensions:
Dimensions:
| COM Mini Heatspreader | 84(W) x 55(D) x ***(H) mm |
| COM Mini Heatsink | 84(W) x 55(D) x ***(H) mm |
ORDERING INFORMATION
OEM WELCOME
