COM Express Compact Heatspreader / Heatsink / Cooler
Heatspreader/Heatsink/Cooler for COM Express Compact Embedded Computer Modules
Intel® Core™ i3, i5, i7, Intel® Bay Trail Atom™ E3800 series and Celeron® families , AMD Embedded G-Series APU
The specifications for COM Express™ Embedded Computer Modules include a heatspreader. It’s a mechanical definition of the thermal interface.
All the heat generated by components such as chipsets and processors are transferred to the system’s cooling via the heatspreader. Various heatsinks and Cooling solutions for different system integration project.
SPECIFICATIONS
Material : Aluminum base 2mm~5mm with Thermal Stacks
DIMENSIONS:
| COM Compact Heatspreader | 95(W) x 95(D) x 3 (H) mm |
| COM Compact Heatsink Lite | 95(W) x 95(D) x 12 (H) mm |
| COM Compact Heatsink Standard | 95(W) x 95(D) x 17 (H) mm |
| COM Compact Heatsink Pro | 95(W) x 95(D) x 20 (H) mm |
| Cooler Standard | 95(W) x 95(D) x 17 (H) mm |
| Cooler Pro | 95(W) x 95(D) x 20 (H) mm |
12VH DC Fan Voltage :12 Vdc, 5500rpm (cable length 200mm, w/3 Pin, Pitch:2.54mm connector)
ORDERING INFORMATION:
