COM Express Basic Heatspreader / Heatsink / Cooler
Heatspreader/Heatsink for COM Express Basic Embedded Computer Modules
Intel® Core™ i3, i5, i7 , Intel® Celeron® 800 series , AMD® R-Series APU
The specifications for COM Express™ Embedded Computer Modules include a heatspreader. It’s a mechanical definition of the thermal interface. All the heat generated by components such as chipsets and processors are transferred to the system’s cooling via the heatspreader. Various heatsinks and Cooling solutions for different system integration project.
SPECIFICATION
Material Aluminum
Dimensions:
Dimensions:
COM Basic Heatspreader | 125(W) x 95(D) x 3 (H) mm |
COM Basic Heatsink Lite | 125(W) x 95(D) x 12(H) mm |
COM Basic Heatsink Standard | 125(W) x 95(D) x 17(H) mm |
COM Basic Heatsink Pro | 125(W) x 95(D) x 20(H) mm |
COM Basic Cooler Standard | 125(W) x 95(D) x 17(H) mm |
COM Basic Cooler Pro | 125(W) x 95(D) x 20(H) mm |
12VH DC Fan Voltage :12 Vdc, 5500rpm (cable length 200mm, w/3 Pin, Pitch:2.54mm connector)